Hi everyone. I just got back my 2nd pcb using 16.6....so far so good. But I'm pretty sure I didnt use the best method for the soldermask so let me ask here. I did read through as much of the Orcad online help and manuals as I could but the pcb had to go out before I could seek out the best method.
I was requested that on some of the etch layer copper shapes....that parts of the soldermask needed to be removed. Not all of it....but some sections. So you'd have the shape most covered with mask but a few sections with exposed copper.
I did it by creating the shape needed by using the SHAPE ADD tool....and putting them on the BOARD GEO > SOLDERMASK LAYER. Then I included that subclass in the soldermask artwork.
After the pcb went out I read in the Orcad manual that was a no no....that filled shapes should only be on etch layers.
So what would have been the right way?
TIA!