As per the IPC-7351B standard we will give Solder mask opening 1:1 , but there will be some special cases like fine pitch BGA or Mask bridge must between pads
where the pad of the type NSMD (SM is bigger than pad) or SMD type (SM is smaller than pad).When we have different type of mask opening requirement in Gerber will
it cause any issue for fabricator ? Will they do component level mask requirement check ? What is the general design consideration we should take care while sending Gerber
(Because I knew that few fabricator usually slightly increase the mask opening of all pads to control the SM registration tolerance.)
Any suggestions on this in generic not specific to particular fab. house ?