Hi
I need few generic guideline input on Selective soldering consideration . I read many doc in net about this topic but not clear what is the best way to take care in footprint
Q1> I am giving 3mm (radius) package keep-out around each through hole pin from center on solder side. is it good enough for selective soldering ?
Q2> Which is the better way to add package keep out in footprint or in the board ?
Please share you suggestion if you know more about selective soldering consideration
Thanks
Girish Kumar