Hello,
Working on a 6 layer board, the stack-up is:
1. Signal_top
2. Gnd
3. V+
4. V-
5. Gnd
6. Signal_bot
There are 2 vias connecting Signal_top to V+ (call it Via+), and another 2 via connecting Signal_top to V- (call it Via-). Th artwork looks to be correct, but I am wondering if I need to generate NC Drill files by "layer pair" or "by layer".
From what I understand:
"layer pair" would generate one drill file for all 6 layers.
"by layer" would generate five drill files, 1-2 2-3 3-4 4-5 5-6.
If drilled by "layer pair", the whole board is press together, drilled, and then plated. I am worried that the plating may not actually connect to the V+ and V- planes. The alternative would be to drill layers 1-2, 3,-4, 5-6, plate each layer, press together, then plate the whole thing again.
which process sounds more reasonable to you guys? I am not an expert in PCB manufacturing.
Thanks for the advice.