Minimum blind/buried via stagger distance

Hi,

I'm using a BGA package controller having 0.5mm pitch and 0.3mm ball dia. I'm getting DRC error named "minimum blind/buried via stagger distance whenever i try to place a via on SMD pad of the controller. I'm using blind via which connects layer 1 to layer 3. There's no error if i place via away from the pad. But i can't do that to pins since its a very tight layout. How can i avoid that DRC error???

Any help would be appreciated.

Regards,

Arun