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Uniform Via Stitching along the RF trace, below the thermal pads of IC and throughout the board

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Dears

Can you please help to understand the different GND via stitching for my recent RFboard.

1. Along the 50E imp track.

2. Below the IC thermal pads, is it at component level?

3. Also via scattered through out the board.

I have followed the path ( Place>> Via array>>Boundary and Matrix) but unable to get the desired result and uniformity.

Many Thanks


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