I am using the Pad Editor in Ver. 17.2-2016 S011 at the moment.
I am trying to create a Pad Stack for a Non-Plated Mounting Hole that has a Donut Pad on the Outer Layers to connect to Ground.
Chassis Ground are on Internal Layers so, within the Board, I will be placing a Via and then adding a Trace to the Copper Donut Pad.
Once I define the Outer Layers as a Donut, the Usage Options at the bottom the Summary Page adds "Enable connect by touch: No"
As I seem to need to use Touch, to connect it to a via, without a DRC violation, I am expecting that this should say "Yes".
Richard