We are working with more QFN packages, which all have the center pad. On almost all datasheets they recommend the stencil design for the solder paste on this center pad to be an array of multiple openings to make sure that a) not too much solder is applied and b) it is well distributed over the surface of the large pad.
I tried to create a custom pad, but cannot as I am only allowed ONE element in the shape.
Since this type of stencil design is now "common place" how is this being supported inside Allegro ?
e.g. of this from the TI CC2650 datasheet