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Issue in internal layer thermal relief offset after creating a padstack in Pad Designer

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Hello All,

I created one padstack for a through hole pin in Pad Designer, and this pad has some characteristics, as described below:

- On TOP and BOTTOM layers, the regular pads are oblong;

- In the inner layers, the regular pads have circle geometry;

- The Drill hole is not located in the center (0,0) of the oblong regular pads - It is moved 0.55 mm to the right side - So, the location of the Drill hole is (X=0.55;Y=0), related to the oblong pads (TOP and BOTTOM);

-  In the inner layers: the regular pads, the thermal relieves and the anti-pads are also moved 0.55 mm to the right side in order for them to be aligned with the drill hole.

 

 

Considering that I used an offset of 0.55 mm to both the drill hole and the Internal Layer pads (reg pad, Thermal relief and Anti-Pad), the thermal relief connects (tie bars) shouldn't have any misalignment problems when connecting to internal copper areas (shapes). However, there's the misalignment problem when connecting to internal copper areas, as can be seen below:

 

 

Is this an issue that needs a fix? Is there a solve for this? Can anybody help me?

 

Any help will be apreciated!

 

Regards,

 

Gustavo


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