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Thermals in smd pin, large pad on top but only via pads on bottom

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In pad editor can you add vias into a  large pad that is going under an IC but only have the large smd pad on top and only via pads on bottom?

In pad editor I create a "thru-pin" pad stack with the large pad on the top design layer.

Which is fine but I don't want a large pad on bottom, only the via pads.


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