Hello,
I have to design a QFN64 footprint with a thermal pad at the center of the component; obviously this pad must be connected to the ground plane of the bottom layer by using vias.
What's the best way to put vias?
1 - Put vias in the pad during "pad designer session" so when i place the pin in the foorprint the vias are already inserted in the footprint;
2 - Place a filled square area for the central pad (without vias) and then place vias during the routing of the board over the filled square
what do you usally do? Are these solution identical for the final result?
Best regards.