Hello,
I am currently working on a 10 layer ELIC (Every Layer Interconnect). It will use micro-via stacks that span the layers of the board. Is there a way to create micro-via stacks? For example ground is on Layer 4 and I have to drop many vias from 1 to 4. My current method is extremely time consuming.
Add Connect
Select Active Layer
Select Alternate Layer
Add Via
Change Alternate Layer to the following Layer
Add Via
And so on and so forth...
I am looking for a solution that would allow me to select the active layer and the destination layer and the micro-via stack to be created automatically. I am familiar with editing pad stacks, however I not quite sure how to do this correctly. There has to be a way to do this, however I have been unable to locate adequate documentation to make this happen. Any and all help would be greatly appreciated.
Thanks,
Clint