Hi,
I have a 4 layer board with a power plane and ground plane. The xSection is setup as a "Positive" plane for both and connections to the power and grounds is correct and I have no DRC errors. I'm using OrCAD PCB Designer 16.6 with the latest patches or close (SP032). I've found that if I go into the Constraints Manager and change a property (i.e. Trace width, or a separation constraint etc. ) the dynamic filled planes go solid and of course then get DRC errors. I have to overcome this by going to the XSection and change to "Negitive" plane for power and ground and then Apply that change and then change back to a "Positive" plane and then the Ground and Power connections and etching is then correct. I've played with the Global Dynamic Parameters under <Shape> but still have the same problem. If someone can shed light on this issue, I would greatly appreciate your input. Seems like a bug in the tool but maybe I'm missing some setting.
Thanks.
KC