Just another obscure challenge that I haven't faced before. I want to create an SMD symbol with a funny shaped pad and an array of drill/vias for thermal connectivity to inner layers. Also want the inner layers to connect with solid non-thermal connections to like-net planes. Again, I'm confused by reading the user guides.
Somewhere the symbol editor guide says you have to define "pads" for connectivity to the bottom and inner layers for the tool to figure out what to do. But I don't really want "pads" on the inner layers, especially one large enough to encompass the entire array of drills that I've defined. I would prefer that the drill holes just connect individually with solid connections to same-net planes or isolation spaces to other-net planes and shapes. So far, I have a large bottom layer pad and "null" inner layer pads defined on the symbol.
The symbol looks OK when placed on a board and I finally got the drill holes to "show up" on the layout display and 3D viewer. It appears as if the drills pass through the inner same-net planes as well as the other-net planes and shapes but with no visual indication of connection or isolation to any of them.
Short of running artwork to see what's connected, is what I want even possible? Also, I haven't been able to find the correct "mode" to assign the "Pin_Dyn_Thermal_Con_Type" property on the symbol, as mentioned elsewhere in the forum.
Thanks in advance for any expert guidance!
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