Ok, I'm stuck......
I have a 144 pin 0.5 pitch BGA that I want to make a footprint which includes the fanout. Signals will use a blind via from the top layer to the second inner layer. Power pins will use a standard thru via. I have both padstacks created, the thru defined on all layers and the blind defined on the top and second inner layer (I have the default internal set to null). Both vias are specified in CM Physical Constraint Set and show properly in the cross section view there.
When I bring the footprint into PCB Editor the blind padstack is now defined on every layer. I have to go into the edit padstack tool and set the unused layers to null in order to get the blind via back that I had specified when I generated the footprint.
I am obviously doing something wrong. I have searched the web, read many things and watched a couple videos but don't seem to be able to find the solution.Obviously I'm doing something wrong . I want a BGA fan out that uses a combination of blind and thru vias designed as a library part that can be brought into PCB Editor and used without further editing. Thoughts?
Tom
PS: Using ver 16.6 Pro