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How to use the some set of vias under the top to bottom layers?

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Hi.. For the specific board design the top and bottom layers should been get connected set of arrays.For that option i had tried to use the thieving parameters. In that rectangle type shape has enabled to use it. but when i am try to use other shaped it is not possible. Suppose if try to put the vias thieving parameters,In case i want to increase the pad size of via directly means the how is it possible? Can i edit the via pad stack in the thieving parameters. Thanks & Regards Dhamodharan

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